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    Title :

    Integration of Simulation and Testing for Microelectronics Package Reliability Improvement



    Conference:

    Session, Electronic packaging ; 1998 ; Detroit; MI


    Published in:

    Electronic packaging ; 1345 ; 33-48

    SAE SP ; 1345


    Publication date :

    1998-01-01


    Size :

    16 pages


    Remarks:

    Held as part of the SAE international congress and exposition



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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