Access

    Access via TIB

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    ThR2 Ultra-Thin Silicon-on-Sapphire for Flip-Chip based CMOS/Optoelectronic Device Integration


    Contributors:

    Conference:

    Annual meeting; 14th, IEEE; Lasers and Electro-Optics Society ; 2001 ; San Diego, CA



    Publication date :

    2001-01-01


    Size :

    2 pages


    Remarks:

    IEEE cat no 01CH37242




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




    Ultra-thin silicon-on-sapphire for flip-chip based CMOS/optoelectronic device integration

    Kuznia, C.B. / Albares, D.J. / Pendleton, M. et al. | IEEE | 2001


    Demonstration of a dense, high-speed optoelectronic technology integrated with silicon CMOS via flip-chip bonding and substrate removal

    Goossen, K. / Lentine, A. L. / Walker, J. A. et al. | British Library Conference Proceedings | 1995



    Au–Sn flip-chip solder bump for microelectronic and optoelectronic applications

    Yoon, J. W. / Chun, H. S. / Koo, J. M. et al. | British Library Online Contents | 2007