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    Title :

    Packaging for Next Generation Automotive Electronics



    Conference:

    Sessions, Software/hardware systems, systems engineering, advanced electronics packaging, and electromagnetic compatibility (EMC); Software/hardware systems, systems engineering, advanced electronics packaging, and electromagnetic compatibility (EMC)



    Publication date :

    2004-01-01


    Size :

    8 pages


    Remarks:

    Held as part of the SAE 2004 world congress



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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    Miller,P. / Nisbet,M. / Ricardo Consulting,GB | Automotive engineering | 2004


    Packaging for Next Generation Automotive Electronics

    Nisbet, M. / Miller, P. | SAE Technical Papers | 2004


    Packaqing for Next Generation Automotive Electronics

    Miller, P. / Nisbet, M. / Society of Automotive Engineers | British Library Conference Proceedings | 2004


    Advanced packaging technologies for automotive electronics

    Sham, Man-Lung / Gao, Ziyang / Leung, L.L.W. et al. | Tema Archive | 2007


    Automotive electronics - Packaging as enabler technology

    Knoblauch, Andreas | Tema Archive | 2010