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    Title :

    Development of Door Module Carrier Using Foam Molding Technology


    Contributors:

    Conference:

    Fall annual congress, Society of Automotive Engineers of Japan; 2008 JSAE annual congress (Fall) ; 2008 ; Nagoya, Japan



    Publication date :

    2008-01-01


    Size :

    132-08


    Remarks:

    Text in Japanese with summaries in English.



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    Japanese




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