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    Title :

    Approximating Convective Boundary Conditions for Transient Thermal Simulations with Surrogate Models for Thermal Packaging Studies


    Contributors:

    Conference:

    WCX SAE World Congress Experience



    Publication date :

    2019-01-01


    Size :

    ALL-ALL



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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