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    Title :

    Cost-effectiveness and environmental aspects of flip chip bumping for system integration


    Contributors:
    Schischke, K. (author) / Griese, H. (author) / Muller, J. (author) / Reichl, H. (author)

    Published in:

    Publication date :

    2003-01-01


    Size :

    7 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



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