Access

    Access via TIB

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    Using megasonic development of SU-8 to yield ultra-high aspect ratio microstructures with UV lithography


    Contributors:
    Williams, J. D. (author) / Wang, W. (author)

    Published in:

    Publication date :

    2004-01-01


    Size :

    5 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



    Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation

    Costello, S. / Strusevich, N. / Flynn, D. et al. | British Library Online Contents | 2013


    High throughput projection UV lithography of high-aspect-ratio thick SU-8 microstructures

    Yang, R. / Mullen, C. / Schaline, M. et al. | British Library Online Contents | 2008


    Fabrication of high-aspect-ratio hydrogel microstructures

    Tirumala, V. R. / Divan, R. / Mancini, D. C. et al. | British Library Online Contents | 2005


    Fabrication of high-aspect-ratio microstructures using SU8 photoresist

    Liu, G. / Tian, Y. / Kan, Y. | British Library Online Contents | 2005


    Ultra Low Aspect Ratio, High Performance Tire Development

    Warchol, John T. / Schneider, Ronald C. | SAE Technical Papers | 1984