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    Title :

    Chip-zu-Chip-Verbindung: 100 Gbit/s und mehr auf der Leiterplatte


    Published in:

    ELEKTRONIK -MUNICH- ; 55 , 15 ; 26-27


    Publication date :

    2006-01-01


    Size :

    2 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    German


    Classification :

    DDC:    621.3