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    Title :

    A GRINDING-BASED MANUFACTURING METHOD FOR SILICON WAFERS: DECOMPOSITION ANALYSIS OF WAFER SURFACES


    Contributors:
    Lu, W. K. (author) / Pei, Z. J. (author) / Fisher, G. R. (author)

    Published in:

    Publication date :

    2007-01-01


    Size :

    17 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    671.35



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