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    Title :

    Package hermeticity testing with thermal transient measurements


    Contributors:

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 15 , 8 ; 1303-1309


    Publication date :

    2009-01-01


    Size :

    7 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83





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