Access

    Access via TIB

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    Quality Detection of Wire Bonding Using Ultrasonic Electrical Signal of Piezoelectric Transducer


    Contributors:
    Feng, W. (author) / Meng, Q. (author) / Xie, Y. (author)

    Published in:

    Publication date :

    2010-01-01


    Size :

    5 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    Unknown


    Classification :

    DDC:    500



    Piezoelectric micromachined ultrasonic transducer based on dome-shaped piezoelectric single layer

    Peng, J. / Chao, C. / Tang, H. | British Library Online Contents | 2010


    wire alignment jig for ultrasonic transducer of vehicle

    YOO GAB SANG / LEE TAE HEE / CHAE MIN KU | European Patent Office | 2018

    Free access

    ULTRASONIC TRANSDUCER

    KOHNO YU | European Patent Office | 2017

    Free access

    Transducer bonding kit

    Roush, R. M., Jr. / Lott, D. A. / Keir, A. R. | NTRS | 1977


    VARIABLE THICKNESS DIAPHRAGM FOR A WIDEBAND ROBUST PIEZOELECTRIC MICROMACHINED ULTRASONIC TRANSDUCER (PMUT)

    BOSER BERNHARD / HORSLEY DAVID / PRZYBYLA RICHARD et al. | European Patent Office | 2015

    Free access