Increasing demands on the reliability of electronic components used in spacecraft, an increase in the density of elements on substrates, the use of new substrate materials makes it necessary to look for an alternative to standard methods for applying conductive and solder layers. The most suitable alternative is the liquid-phase magnetron sputtering method (LPMS), which has a number of significant advantages for the deposition of metallic conductive and solder layers in the thickness range from 10 to 100 microns, such as high deposition rates, the purity of the coatings obtained, the ability to control the coating structure, and environmental friendliness. The LPMS has a number of features as compared with the classical magnetron sputtering method, associated, among other things, with the properties of the sputtered material. The article provides a classification of materials, and also describes the processes of magnetron sputtering for materials of different groups, which allows to select the conditions of the process depending on the material, including self-sputtering mode.


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    Title :

    Use of magnetron sputtering with liquid target in manufacturing of electronic components for spacecraft



    Conference:

    XLIII ACADEMIC SPACE CONFERENCE: dedicated to the memory of academician S.P. Korolev and other outstanding Russian scientists – Pioneers of space exploration ; 2019 ; Moscow, Russia


    Published in:

    Publication date :

    2019-11-15


    Size :

    5 pages





    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English





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