Transition in spacecraft development from aluminum to light weight/high performance avionic composite enclosures will be reviewed that influences the new initiative in aerospace thrust, including missile application. Discussion will focus on the type of processed hybrid cooled and passive composite enclosures and internal lightweight, high conductivity composite and graphitic thermal plane heat sinks. Applications are for electronic circuit boards for spacecraft up to 40W/card (VME, PCI architectures) to 120W/card for aircraft application.
Materials Opportunity to Electronic Composite Enclosures for Aerospace and Spacecraft Thermal Management
SPACE TECH.& APPLIC.INT.FORUM-STAIF 2006: 10th Conf Thermophys Applic Microgravity; 23rd Symp Space Nucl Pwr & Propulsion; 4th Conf Human/Robotic Tech & Nat'l Vision for Space Explor.; 4th Symp Space Coloniz.; 3rd Symp on New Frontiers & Future Concepts ; 2006 ; Albuquerque, New Mexico (USA)
AIP Conference Proceedings ; 813 , 1 ; 19-26
2006-01-20
8 pages
Conference paper
Electronic Resource
English
British Library Conference Proceedings | 2006
|Materials Opportunity for Spacecraft and Aerospace Thermal Management
British Library Conference Proceedings | 2005
|Materials Opportunity for Spacecraft and Aerospace Thermal Management
American Institute of Physics | 2005
|Lightweight Electronic Enclosures Using Composite Materials
British Library Conference Proceedings | 1994
|