Correlation of thermal cycles tests to field usage profile for solder joints in automotive electronics
Korrelation zwischen Tests bei thermischer Wechselbelastung und dem Nutzungsprofil im Feld fuer Loetverbindungen der Kraftfahrzeugelektronik.
1998
8 pages
SAE-Paper;980344;1998;Electronic Packaging;SAE Spec.Publ.; SP-1345
Miscellaneous
English
British Library Conference Proceedings | 1998
|SAE Technical Papers | 1998
|Thermal fatigue reliability of leadless solder joints in automotive environment
Tema Archive | 1993
|Lead Free Solder for Automotive Electronics
SAE Technical Papers | 1998
|Lead free solder for automotive electronics
Automotive engineering | 1998
|