The embodiment of the invention provides a heat dissipation assembly. The heat dissipation assembly comprises a cold plate, a uniform temperature plate and a heat conduction assembly, one side of the uniform temperature plate is attached to a heating device on the main board; a cold plate is arranged on one side, back on to the mainboard, of the uniform temperature plate; a PCB is fixed between the uniform temperature plate and the cold plate, a connector is fixed on the PCB, one end of the connector is connected with the PCB, the connector penetrates through the uniform temperature plate, and the other end of the connector extends towards the mainboard and is fixed on the mainboard; the cold plate is connected with the uniform temperature plate through a heat conduction assembly so that heat generated by the heating device can be transmitted to the cold plate through the uniform temperature plate and the heat conduction assembly. The heat dissipation assembly can be applied to an automatic driving automobile, an intelligent automobile, a network connection automobile and a new energy automobile, heat of the heating device on the main board is transmitted to the cold board through the uniform temperature board, the PCB is arranged between the uniform temperature board and the cold board, a connector between the PCB and the main board cannot break a flow channel of the cold board, and the heat dissipation efficiency is improved. And the heat dissipation performance of the cold plate is further improved.

    本申请实施例提供了一种散热组件,包括:冷板、均温板以及导热组件;均温板的一侧与主板上的发热器件贴合;均温板背向主板的一侧设置有冷板;均温板与冷板之间固定有PCB板,PCB板上固定有连接器,连接器的一端与PCB板连接,连接器穿过均温板,且连接器的另一端向主板延伸并固定在主板上;冷板与均温板之间通过导热组件连接,以便发热器件产生的热量通过均温板和导热组件传递至冷板。本申请提供的散热组件可以应用在自动驾驶汽车、智能汽车、网联汽车、新能汽车上,本实施例由均温板将主板上的发热器件的热量传递至冷板,均温板和冷板之间设置PCB板,使得PCB板与主板之间的连接器不会打断冷板流道,进而提高了冷板的散热性能。


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    Title :

    Heat dissipation assembly and automobile


    Additional title:

    一种散热组件及汽车


    Contributors:

    Publication date :

    2023-08-29


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    Chinese


    Classification :

    IPC:    H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES



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