The invention relates to the technical field of semiconductor manufacturing process equipment, and discloses a carrying device which comprises a first operation module, a second operation module and a third operation module. The second operation module is detachably connected with the first operation module and comprises a supporting part, a moving part and a tool part, and the supporting part is movably connected with the base through the moving part so that the moving part can drive the supporting part to move on the base in the first direction; the tool part is movably installed on the supporting part and used for moving the parts placed on the tool part in the second direction, and the first direction is different from the second direction. According to the device, parts of the semiconductor equipment can move in a narrow space in a multi-degree-of-freedom mode in the carrying process, and enough operation space is reserved. The invention further discloses a using method of the carrying device.
本申请涉及半导体制造工艺设备技术领域,公开一种搬运装置,包括:第一操作模组,包括底座;第二操作模组,与所述第一操作模组可拆卸连接,包括支撑部、移动部和工装部,其中:所述支撑部通过移动部与所述底座可移动连接,以使所述移动部带动所述支撑部在所述底座上沿第一方向移动;所述工装部可移动安装于所述支撑部,用于将放置于工装部的零部件沿第二方向移动,且所述第一方向和第二方向不相同。该装置使得半导体设备的零部件在搬运的过程中可以在狭窄空间中进行多自由度的移动,并留出足够的操作空间。本申请还公开一种搬运装置的使用方法。
Carrying device and using method thereof
一种搬运装置及其使用方法
2024-03-22
Patent
Electronic Resource
Chinese
IPC: | B66F HOISTING, LIFTING, HAULING, OR PUSHING, NOT OTHERWISE PROVIDED FOR, e.g. DEVICES WHICH APPLY A LIFTING OR PUSHING FORCE DIRECTLY TO THE SURFACE OF A LOAD , Hub-, Verhol- oder Schubvorrichtungen, soweit nicht anderweitig vorgesehen, z.B. Vorrichtungen mit unmittelbarer Krafteinwirkung auf die Last |
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