The invention discloses a mounting device and method for improving the stability of semiconductor equipment, and the device comprises a mounting plate, a first adjusting mechanism, a second adjusting mechanism, a fastening mechanism, a baffle plate, and universal wheels, and when the semiconductor equipment needs to be used in a standing manner, a second lifting plate is adjusted to the bottommost end; the semiconductor equipment is fixed through the fastening plates of the two fastening mechanisms, the first driving motor drives the first screw to rotate, the first lifting plate descends to drive the supporting plate to make contact with the ground, the first adjusting mechanisms on the periphery of the mounting plate are adjusted, and the semiconductor equipment can be conveniently adjusted to be in a horizontal state; and when the semiconductor equipment needs to be carried, a first driving motor drives a first screw rod to rotate, so that a first lifting plate ascends and drives a supporting plate to ascend, universal wheels on a second mechanism fixing plate make contact with the ground, and the semiconductor equipment can be conveniently carried. And the whole device is convenient to carry.
本发明公开了一种用于提升半导体设备稳定性的安装装置及安装方法,包括安装板、调节机构一、调节机构二、紧固机构、挡板以及万向轮,在半导体设备需要静置使用时,将升降板二调节至最底端,通过两个紧固机构的紧固板将半导体设备固定,通过驱动电机一驱动螺杆一转动,使得升降板一下降带动支撑板与地面接触,通过对安装板四周的调节机构一分别进行调节,可方便将半导体设备调节至水平状态,配合紧固机构对半导体设备进行固定可提升半导体设备静置运行时的稳定性,在需要搬运半导体设备时,通过驱动电机一驱动螺杆一转动,使得升降板一上升并带动支撑板上升,机构固定板二上的万向轮与地面接触,便于对装置整体进行搬运。
Mounting device and mounting method for improving stability of semiconductor equipment
一种用于提升半导体设备稳定性的安装装置及安装方法
2024-10-11
Patent
Electronic Resource
Chinese
IPC: | F16M Rahmen, Gehäuse oder Grundplatten von Kraftmaschinen oder anderen Maschinen oder von Apparaten, nicht auf eine besondere Art von Maschine oder Apparat eingeschränkt, die anderweitig vorgesehen ist , FRAMES, CASINGS, OR BEDS, OF ENGINES OR OTHER MACHINES OR APPARATUS, NOT SPECIFIC TO AN ENGINE, MACHINE, OR APPARATUS PROVIDED FOR ELSEWHERE / B60B VEHICLE WHEELS , Räder für Fahrzeuge / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES |
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