The invention relates to an air conditioner linkage air cooling heat dissipation device and a vehicle-mounted semiconductor cooling and heating box. The technical problem that an existing thermoelectric semiconductor is prone to being affected by the environment temperature is solved. Comprising a fan wind scooper, a heat dissipation wind guide cavity is formed in the fan wind scooper, a hot end heat dissipation structure is arranged in the heat dissipation wind guide cavity, a semiconductor assembly is arranged on one side of the hot end heat dissipation structure, a cold end heat dissipation structure is arranged on the other side of the semiconductor assembly, and a wind guide assembly corresponding to the hot end heat dissipation structure is arranged in the fan wind scooper. An air conditioner air pipe communicated with the heat dissipation air guide cavity is arranged on the outer side of the fan air guide cover, and a pipeline valve body assembly is arranged between the air conditioner air pipe and the heat dissipation air guide cavity. The semiconductor assembly has the advantages that the air-conditioning air pipe can enable air-conditioning air to be communicated with the heat dissipation air guide cavity, and the refrigerating and heating effects of the semiconductor assembly are improved. The pipeline valve body assembly can control the connection relation between the air conditioner air pipe and the heat dissipation air guide cavity, a user can conveniently control the pipeline valve body assembly according to the use condition, and the heat exchange efficiency is improved.
本发明涉及一种空调联动风冷散热装置与车载半导体冷暖箱。它解决了现有热电半导体容易受到环境温度的影响等技术问题。包括风机导风罩,风机导风罩内设有散热导风腔,散热导风腔内设有热端散热结构,热端散热结构一侧设有半导体组件,半导体组件另一侧设有冷端散热结构,风机导风罩内设有与热端散热结构对应设置的导风组件,且风机导风罩外侧设有与散热导风腔相连通的空调风管,空调风管与散热导风腔之间设有管道阀体总成。优点在于:空调风管能够使空调风与散热导风腔相连通,提高半导体组件的制冷制热效果。管道阀体总成能够控制空调风管与散热导风腔之间的连接关系,便于用户根据使用情况对管道阀体总成进行控制,提高换热效率。
Air conditioner linkage air cooling heat dissipation device and vehicle-mounted semiconductor cooling and heating box
一种空调联动风冷散热装置与车载半导体冷暖箱
2025-02-25
Patent
Electronic Resource
Chinese
IPC: | B60H ARRANGEMENTS OR ADAPTATIONS OF HEATING, COOLING, VENTILATING, OR OTHER AIR-TREATING DEVICES SPECIALLY FOR PASSENGER OR GOODS SPACES OF VEHICLES , Anordnung oder Einbau der Heizung, Kühlung, Lüftung oder anderer Luftbehandlungsvorrichtungen für die Fahrzeugräume für Reisende oder Fracht |
Air conditioner linkage heat dissipation device and vehicle-mounted semiconductor refrigerator
European Patent Office | 2025
|European Patent Office | 2025
|Water-cooling heat dissipation vehicle-mounted device and electric vehicle
European Patent Office | 2025
|Heat dissipation device and heat dissipation method of vehicle-mounted liquid cooling system
European Patent Office | 2020
|Liquid cooling heat dissipation device of power device and vehicle-mounted charger
European Patent Office | 2024
|