A heater panel includes a core (102) and a heater/dielectric layer (104) including a positive thermal coefficient (PTC) heater layer between a pair of dielectric layers. A structural facing (110) is included, wherein the heater/dielectric layer (104) is bonded directly between the core and the structural facing. A second structural facing (112) can be bonded to the core (102) opposite the heater/dielectric layer (104). An impact layer (114) can be bonded to the structural facing (110), e.g., the first structural facing (110) described above, opposite the heater/dielectric layer (104).
HEATED FLOOR PANELS
BEHEIZTE BODENPLATTEN
PANNEAUX DE PLANCHER CHAUFFÉS
2020-01-08
Patent
Electronic Resource
English