Provided is a thermoelectric conversion device which can diffuse heat uniformly on the surface thereof, can thermally insulate a heat-generating extreme from a heat-absorbing extreme of a thermoelectric conversion element pair without giving rise to deformation in the form of bumps and dips due to application of pressure, and has high durability owing to high strength of bonding with the sheets sandwiching a thermoelectric conversion chip.A thermoelectric conversion device 1 comprises: a thermoelectric module layer 20, in which a thermoelectric conversion chip 21 is surrounded by a thermal insulation rubber 22 containing a rubber component 22a and a hollow filler 22b forming a plurality of air gaps that are independent from one another; an insulation base layer 10 and an insulation intermediate layer 30, which are thermal-conductive insulation sheets and sandwiches the thermoelectric module layer 20; a heat diffusion layer 40, which has a higher thermal conductance than those of the insulation base layer 10 and the insulation intermediate layer 30 and is stacked on the insulation intermediate layer 30; and a thermal radiation layer 50, which has thermal conductivity and is stacked on the heat diffusion layer 40. And at least one pair among the adjacent layers 10, 20, 30, 40, 50 is bonded through chemical bonds.
THERMOELECTRIC CONVERSION DEVICE
VORRICHTUNG FÜR THERMOELEKTRISCHE UMWANDLUNG
DISPOSITIF DE CONVERSION THERMOÉLECTRIQUE
2024-10-09
Patent
Electronic Resource
English
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