PROBLEM TO BE SOLVED: To avoid overheat state without requiring addition of a temperature sensor and the like, with regard to an electronic controller including a control IC housed in a resin enclosure.SOLUTION: An electronic controller includes: a resin enclosure; a substrate housed in the enclosure; a first IC and a second IC mounted on the substrate and each having the same function; first inner layer winding provided adjacently to the surface of the substrate on the back side of the first IC; second inner layer winding provided adjacently to the surface of the substrate on the back side of the second IC; a first metal heat dissipation member where one end is connected with the substrate surface on the back side of the first IC, in a form having a first separation part facing the first inner layer wiring while separated therefrom, and the other end is connected with a metal member on the outside of the enclosure; and a second metal heat dissipation member where one end is connected with the substrate surface on the back side of the second IC, in a form having a second separation part facing the second inner layer wiring while separated therefrom, and the other end is connected with a metal member on the outside of the enclosure.SELECTED DRAWING: Figure 2
【課題】樹脂製の筐体に収容される制御用のICを含む電子制御装置に関して、温度センサ等の追加を要することなく、過熱状態を回避すること。【解決手段】樹脂製の筐体と、筐体の内部に収納される基板と、基板に搭載され、各々が同一の機能を有する第1のIC及び第2のICと、第1のICの裏側の基板の面に隣接して設けられる第1の内層配線と、第2のICの裏側の基板の面に隣接して設けられる第2の内層配線と、一端が、第1の内層配線と対向して離間する第1の離間部を有する態様で、第1のICの裏側の基板の面に接続すると共に、他端が、筐体の外部の金属部材に接続する、金属製の第1の放熱部材と、一端が、第2の内層配線と対向して離間する第2の離間部を有する態様で、第2のICの裏側の基板の面に接続すると共に、他端が、筐体の外部の金属部材に接続する、金属製の第2の放熱部材と、を備える。【選択図】図2
ELECTRONIC CONTROLLER
電子制御装置
2018-03-22
Patent
Electronic Resource
Japanese
ELECTRONIC CONTROLLER, VEHICLE AND ELECTRONIC CONTROLLER MANUFACTURING METHOD
European Patent Office | 2017
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