본 발명의 일 실시예에 따른 차량용 열관리 유체 모듈은 내부에 유체가 유동하는 유로가 형성되는 매니폴드 플레이트, 및 상기 매니폴드 플레이트에 각각 결합되고, 복수개의 열교환 플레이트가 적층되어 유체가 유동하면서 열교환되는 열교환기를 포함하고, 상기 열교환 플레이트의 적층 방향은 상기 매니폴드 플레이트와 수직한 방향으로 배치될 수 있다.

    A fluid module for automotive thermal management according to an embodiment of the present invention comprises: a manifold plate having channels therein through which fluid flows; and heat exchangers coupled to the manifold plate, and each having a plurality of heat-exchange plates that are stacked to allow fluid to flow and heat-exchange to occur, wherein the stacking direction of the heat exchange plates may be perpendicular to the manifold plate.


    Access

    Download


    Export, share and cite



    Title :

    FLUID MODULE FOR AUTOMOTIVE THERMAL MANAGEMENT


    Additional title:

    차량용 열관리 유체 모듈


    Contributors:

    Publication date :

    2024-09-20


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    Korean


    Classification :

    IPC:    F25B Kältemaschinen, Kälteanlagen oder Kälteverfahren , REFRIGERATION MACHINES, PLANTS, OR SYSTEMS / B60H ARRANGEMENTS OR ADAPTATIONS OF HEATING, COOLING, VENTILATING, OR OTHER AIR-TREATING DEVICES SPECIALLY FOR PASSENGER OR GOODS SPACES OF VEHICLES , Anordnung oder Einbau der Heizung, Kühlung, Lüftung oder anderer Luftbehandlungsvorrichtungen für die Fahrzeugräume für Reisende oder Fracht



    Automotive thermal management fluid module

    KANG IN KEUN | European Patent Office | 2024

    Free access

    AUTOMOTIVE THERMAL MANAGEMENT FLUID MODULE

    KANG IN KEUN | European Patent Office | 2024

    Free access

    FLUID MODULE FOR AUTOMOTIVE THERMAL MANAGEMENT

    KANG IN KEUN / OH SEUNG KYU / LEE KYEONG CHEOL et al. | European Patent Office | 2024

    Free access

    FLUID MODULE FOR AUTOMOTIVE THERMAL MANAGEMENT

    KIM MIN SUNG / KIM MOO JOONG / KIM SEONG HUN et al. | European Patent Office | 2024

    Free access

    FLUID MODULE FOR AUTOMOTIVE THERMAL MANAGEMENT

    KANG IN KEUN | European Patent Office | 2024

    Free access