A semiconductor sensor device includes a lead frame flag having a vent hole, an interposer mounted on the flag and having a vent hole in fluid communication with the vent hole of the flag, and a sensor die having an active region. The sensor die is mounted on and electrically connected to the interposer in a flip-chip manner such that the vent hole of the interposer is in fluid communication with the active region of the sensor die. Bond wires electrically connect the interposer to one or more other components of the device. A molding compound covers the sensor die, the interposer, and the bond wires. The sensor die may be a pressure-sensing (P-cell) die, and the device may also include a micro-controller unit (MCU) die and an acceleration-sensing (G-cell) die, for tire pressure monitoring applications.
Sensor device with flip-chip die and interposer
2020-09-29
Patent
Electronic Resource
English
IPC: | H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / B60C VEHICLE TYRES , Fahrzeugreifen / B81B Mikrostrukturbauelemente oder -systeme, z.B. mikromechanische Bauelemente , MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES / B81C Verfahren oder Geräte besonders ausgebildet zur Herstellung oder Behandlung von Mikrostrukturbauelementen oder -systemen , PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS / G01L Messen von Kraft, mechanischer Spannung, Drehmoment, Arbeit, mechanischer Leistung, mechanischem Wirkungsgrad oder des Drucks von Fluiden , MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE |
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