An inverter assembly contains at least one semiconductor package with external electrical connections, and at least one external connecting pin for a signal or control terminal, a printed circuit board placed above and spaced apart from the semiconductor package, wherein the at least one connecting pin passes through a hole in the printed circuit board and is attached thereto, and a temperature sensor placed near the at least one connecting pin on the printed circuit board, such that it can measure the temperature of a power semiconductor in the semiconductor package transferred to the connecting pin.
INVERTER ARRANGEMENT FOR MONITORING THE TEMPERATURE OF POWER SEMICONDUCTORS
2025-06-19
Patent
Electronic Resource
English
IPC: | H02M APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS , Anlagen zur Umformung von Wechselstrom in Wechselstrom, von Wechselstrom in Gleichstrom oder umgekehrt, oder von Gleichstrom in Gleichstrom und zur Verwendung in Netzen oder ähnlichen Stromversorgungssystemen / B60L PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES , Antrieb von elektrisch angetriebenen Fahrzeugen |
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