An optoelectronic semiconductor module includes a chip carrier, a light emitting semiconductor chip mounted on the chip carrier and a cover element with an at least partly light transmissive cover plate, which is arranged on the side of the semiconductor chip facing away from the chip carrier, and has a frame part, wherein the frame part laterally encloses the semiconductor chip, is joined to the cover plate in a joining-layer free fashion and is joined to the chip carrier on its side remote from the cover plate.
Opto-electronic semiconductor module and method for the production thereof
2017-02-07
Patent
Electronic Resource
English
IPC: | B63B Schiffe oder sonstige Wasserfahrzeuge , SHIPS OR OTHER WATERBORNE VESSELS / F21V FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF , Funktionsmerkmale oder Einzelheiten von Leuchten oder Beleuchtungssystemen / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / H05B ELECTRIC HEATING , Elektrische Heizung |
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