The problem and the challenge of the physical (mechanical) design for reliability of solder joint interconnections (SJIs) for aerospace electronics is addressed and some practically useful solutions to this problem are suggested and discussed in detail. The considered problem includes: 1) the possibility of avoiding inelastic strains in the solder material; 2) quantification, on the probabilistic basis, the expected lifetime of the SJI of interest; and 3) possible replacement of the temperature cycling accelerated testing with a more physically meaningful, less costly and less time- and labor consuming low-temperature/random-vibration bias. The general concepts are illustrated by numerical examples.


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    Title :

    Physical Design for Reliability of Solder Joint Interconnections for Application in Aerospace Electronics


    Contributors:
    Suhir, E. (author) / Yi, S. (author) / Nicolics, J. (author)


    Publication date :

    2019-06-01


    Size :

    2944700 byte





    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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