Significant size, weight, power and reliability improvements can be achieved in next generation avionics by the modular integration of similar functions into a fault tolerant reconfigurable architecture. The Integrated Communication Navigation Identification Avionics program (ICNIA), and ITT/TI Joint Venture, is accomplishing this task with a combination of modular circuit designs using VHSIC technology, improved packaging designs incorporating surface mount component technology and a modular two-level maintenance support concept for reduced life cycle cost. This article will concentrate on the modular packaging technology of the digital processor subsystem.


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    Title :

    Modular ICNIA Packaging Technology


    Contributors:


    Publication date :

    1987-06-01


    Size :

    2576543 byte




    Type of media :

    Article (Journal)


    Type of material :

    Electronic Resource


    Language :

    English