Optoelectronic bonding has been performed onto sample MCMs, which are to be used for optical testing on HOLMS demonstrator. The photodiodes and VCSELs were successfully bonded, but we experienced problems attaching the Mixed Signal chips.


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    Title :

    Solutions to optoelectronic interconnect problems


    Contributors:


    Publication date :

    2005-06-01


    Size :

    448987 byte



    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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