New bonding processes between TCP and glass panel with ACF using HPDL are investigated. Results showed that this method can solve conventional bonding problems caused by pressure unbalance and thermal expansion mismatch of hot plate.
A New Method of Anisotropic Conductive Film Bonding by High Power Diode Laser(HPDL)
2005 Quantum Electronics and Laser Science Conference ; 3 ; 1585-1587
2005-01-01
1384180 byte
Conference paper
Electronic Resource
English
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