New bonding processes between TCP and glass panel with ACF using HPDL are investigated. Results showed that this method can solve conventional bonding problems caused by pressure unbalance and thermal expansion mismatch of hot plate.


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    Title :

    A New Method of Anisotropic Conductive Film Bonding by High Power Diode Laser(HPDL)


    Contributors:


    Publication date :

    2005-01-01


    Size :

    1384180 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English




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