This paper describes sea of leads (SoL), its processing, its process integration with optoelectronic devices, and its optical, electrical, and mechanical characteristics.
Wafer-level packaging of optoelectronic chips using sea of leads electrical and optical I/O interconnections
2004-01-01
84151 byte
Conference paper
Electronic Resource
English
British Library Conference Proceedings | 2004
|British Library Online Contents | 2004
|Direct bonding with on-wafer metal interconnections
British Library Online Contents | 2006
|Optoelectronic Packaging for Optical Interconnects
British Library Online Contents | 2006
|British Library Conference Proceedings | 2001
|