This paper describes sea of leads (SoL), its processing, its process integration with optoelectronic devices, and its optical, electrical, and mechanical characteristics.


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    Title :

    Wafer-level packaging of optoelectronic chips using sea of leads electrical and optical I/O interconnections


    Contributors:
    Bakir, M.S. (author) / Meindl, J.D. (author)


    Publication date :

    2004-01-01


    Size :

    84151 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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