Summary form only given. Optical backplanes can enhance the functionality of large system products at reasonable cost. In order to further exploit high technology, high fibre count multivendor multifiber array backplane connectors are needed. Intermateability at the backplane is a key goal. This should not preclude a wide variety of packaging approaches on both sides of the backplane. Standard multimode and single mode fibers should be supported, along with specialty fibers if desired. Two dimensional arrays with high fiber counts will be particularly useful. Backplane interconnection density is crucial and multifiber array connectors are powerful tools in this area.
Packaging of optoelectronics and passive optics for intrasystem interconnects
Proceedings of LEOS'94 ; 1 ; 222-223 vol.1
1994-01-01
161464 byte
Conference paper
Electronic Resource
English
Packing of Optoelectronics and Passive Optics for Intrasystem Interconnects
British Library Conference Proceedings | 1994
|Intrasystem electromagnetic compatibility program (IEMCAP)
Tema Archive | 1980
|Updated Assessment of GNSS Intrasystem and Intersystem Interference for Airborne Equipment
British Library Conference Proceedings | 2018
|Automotive engineering | 2001
|Methodology to ensure the intrasystem electromagnetic compatibility of UAV avionics
Online Contents | 2016
|