Using water to reduce the redeposition of ablation debris, high precision holes, with diameter of 4 /spl mu/m and depth over 200 /spl mu/m, were drilled from the rear surface of silica glass with infrared femtosecond laser pulses. The long holes with very small diameters had a well-defined wall without obvious taper.


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    Title :

    Hole drilling of silica glass with infrared femtosecond laser pulses


    Contributors:
    Yan Li, (author) / Itoh, K. (author) / Watanabe, W. (author)


    Publication date :

    2001-01-01


    Size :

    194929 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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