The Report covers the development of reliable electronic assemblies for spacecraft. The basic details of the hermetic, integral substrate, ceramic package are described, together with the handling and use of the thick film and active and passive devices. The qualification of the system for two UK satellite programs and its successful performance are discussed.


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    Title :

    Multichip Integrated Circuits in UK Spacecraft


    Contributors:

    Publication date :

    1975


    Size :

    33 pages


    Type of media :

    Report


    Type of material :

    No indication


    Language :

    English




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