Relation between packaging design and cooling, vibration, RF interference and reliability of microelectronic systems used in space vehicles


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    Title :

    Reliability through packaging design.


    Contributors:
    Kuehn, R. E. (author) / Price, F. J. (author)

    Publication date :

    1966-01-01


    Type of media :

    Conference paper


    Type of material :

    No indication


    Language :

    English




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