Laser scribing eliminates microcracking at scribe line intersections, minimizes or eliminates preparation of scribe channels, and increases yield during the breaking process. Rapid overlapping of spots in the form of a line permits scribing speeds of 1.5 to 2.5 in./sec at 50 pulses/sec.


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    Title :

    Laser scribing of silicon wafers


    Contributors:
    Calihan, C. (author)

    Publication date :

    1970-10-01


    Type of media :

    Miscellaneous


    Type of material :

    No indication


    Language :

    English




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