Report discusses how effects of moisture and other factors causing bridging between conductors can be prevented. Study details how several factors such as contaminants, large packages, high voltage, narrow conductor spacing and temperature contribute to moisture problems.
Eliminating gold migration in microcircuits
NASA Tech Briefs ; 3 , 4
1979-03-01
Miscellaneous
No indication
English
Emerald Group Publishing | 2007
Sealing microcircuits with adhesives
NTRS | 1979
|Coatings for hybrid microcircuits
NTRS | 1980
|Removing overcoatings from microcircuits
NTRS | 1979
|Organic adhesives for hybrid microcircuits
NTRS | 1976
|