Vaporization-cooled heat sink proposed for use during soldering of multiple electrical leads of packaged electronic devices to circuit boards. Heat sink includes compliant wicks held in grooves on edges of metal fixture. Wicks saturated with water. Prevents excessive increases in temperature at entrances of leads into package.


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    Title :

    Multilead, Vaporization-Cooled Soldering Heat Sink


    Contributors:
    Rice, John (author)

    Published in:

    Publication date :

    1995-04-01



    Type of media :

    Miscellaneous


    Type of material :

    No indication


    Language :

    English






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