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    Title :

    Update on High I/O Area Array Packages and Assembly Reliability


    Contributors:

    Conference:

    Microelectronics Reliability and Qualification Workshop (MRQW) ; 2009 ; Manhattan Beach, CA, United States


    Publication date :

    2009-12-08


    Type of media :

    Miscellaneous


    Type of material :

    No indication


    Language :

    English





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