Begins with a review of semiconductor wire bonding techniques utilizing both thermocompression and ultrasonic methods. Next, disadvantages of using interconnect leadwires are covered. Finally, a description of leadless face bonding is included with emphasis on the important functions in state-of-the-art techniques as well as on simplicity, accuracy and repeatability.


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    Title :

    Semiconductor: Wire Bonding and Face Bonding Considerations and Comparisons


    Additional title:

    Sae Technical Papers


    Contributors:

    Conference:

    Micro Electronic Packaging Conference ; 1968



    Publication date :

    1968-02-01




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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