This paper describes the latest Fluorescent Indicator Panel (FIP) technology, featuring integrated circuits mounted within the vacuum envelope on the glass substrate. This is called Chip-in-Glass FIP, or CIG FIP. The discussion includes basic technologies, design flexibility, reliability, and driver ICs.


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    Title :

    Chip-in-Glass FIP's (Fluorescent Indicator Panel) for Automotive Applications


    Additional title:

    Sae Technical Papers


    Contributors:

    Conference:

    SAE International Congress and Exposition ; 1987



    Publication date :

    1987-02-01




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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