There is an explosion taking place in automotive electronics applications. From an estimated electronics content in 1988 of an average $400 value per vehicle, most experts forecast a growth to over $2,000/ vehicle by the year 2000.Virtually all functions in future vehicles will be controlled electronically. Electronic control units (ECUs) will be utilized to monitor and control engine and transmission functions, ignition, anti-lock braking and positive traction, active suspension, power steering, active navigation, air bag actuation, collision avoidance, entertainment, comfort control systems and many other automotive functions.This article outlines a novel electronics packaging concept that brings unparalleled reliability to surface mounted component electronic assemblies and allows these ECUs to be mounted under the hood of vehicles or in other advantageous locations on or very near the devices and functions the ECUs are controlling.


    Access

    Check access

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    An Electronic High Density Packaging Concept Suitable for Under the Hood Automotive Applications


    Additional title:

    Sae Technical Papers


    Contributors:

    Conference:

    International Congress & Exposition ; 1992



    Publication date :

    1992-02-01




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English





    Electronic high-density packaging for under the hood

    Casson,K. / Sheldahl,US | Automotive engineering | 1992


    High density packaging for automotive applications

    Sommer, J.P. / Michel, B. / Hofmann, Th et al. | Tema Archive | 2011



    High temperature, high power density packaging for automotive applications

    Gerber, M. / Ferreira, J.A. / Hofsajer, I.W. et al. | Tema Archive | 2003