This specification covers a single-component, unfilled, heat-reactive, thermosetting, aromatic system which thermally cures to form a polyimide polymer structure.
RESIN, POLYIMIDE, SEALING High-Temperature Resistant, 315°C (600°F) Unfilled
2011-08-12
Conference paper
English
Resin, Polyimide, Sealing High-Temperature Resistant, 315 °C (600 °F) Unfilled
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