This specification covers a two-part epoxy resin system in the form of a bisphenol "A" epoxy resin filled with fumed silica and carbon microspheres and a separate curing agent.
RESIN SYSTEM, EPOXY, CARBON MICROBALLOON FILLED 135°C (275°F) Cure
2011-08-09
Conference paper
English
Resin System, Epoxy, Carbon Microballoon Filled, 135 °C (275 °F) Cure
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