This paper addresses the packaging considerations and techniques used in the design of a fully integrated VSCF package which is mounted on an engine accessory gearbox. Special design considerations such as vibration, altitude, and temperature in the gearbox area are discussed. A comparison and description of various methods of cooling, such as cold plate, immersion, and spray within a self contained cooling/lubrication system is also presented. The paper describes the integration of microprocessor modules, high power semiconductor arrays, and a high-speed generator, to form a compact, low weight VSCF system.


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    Title :

    Packaging the VSCF System for an Aircraft Engine Environment


    Additional title:

    Sae Technical Papers


    Contributors:

    Conference:

    Aerospace Congress and Exposition ; 1981



    Publication date :

    1981-10-01




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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