This Engineering Bulletin and its annexes provide guidance to Original Equipment Manufacturers (OEMs) in evaluating device manufacturer flows and in selecting cost effective, standard products that meet the performance objective for potential use in many rugged, military, severe, or other environments.


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    Title :

    Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications


    Publication date :

    2000-08-01



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English