Methods of measuring electrical bonding of large, complex structures such as aircraft are discussed. The importance of measurement method design and result interpretation are stressed. The methods which are described are either large scale, such as potential plotting, potential mapping and infrared scanning, or examine a small area, such as the resistance of individual fasteners. These methods have all been used in situ on service aircraft or large mock-ups. The limitations on the measurement methods are pointed out and the potential uses of the results, to predict poor bonding areas, set specifications etc., suggested.


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    Title :

    Techniques for in-situ measurement of electrical bonding on aircraft structures


    Additional title:

    Techniken fuer die In-situ-Messung der elektrischen Verbindung in Flugzeugstrukturen


    Contributors:


    Publication date :

    1985


    Size :

    7 Seiten, 2 Quellen



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English




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