Single micro-electro-mechanical system (MEMS)-type sensors have been used for a variety of automotive and medical applications. However, there has been very little activity in the area of multisensor systems. Boeing is developing a MEMS multisensor system suitable for aerospace applications, including the hardware, firmware, and software necessary to run such a system. In this paper, we report the development of a smart sensor multi-chip module (MCM) containing MEMS-based pressure transducers. The module contains a bare MEMS device, and a CMOS analog signal processor ASIC, an EEPROM and a number of passives. The MCM-D substrate was fabricated on oxidized silicon using copper as conductor and photosensitive polyimide as dielectric material. Assembly of the module was conducted by utilizing various microelectronic interconnection techniques. The MEMS device was bonded using direct-chip-attachment technique (flip chip) to minimize the height. Finally silicone molding was applied to the module for environmental protection. Functionality was tested by measuring electrical responses as a function of pressure and temperature.


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    Title :

    Smart sensor multi-chip module with direct-chip-attached micro-electro-mechanical system (MEMS) device


    Contributors:
    Kim, N.P. (author) / Li, K. (author) / Kovach, D.J. (author) / Chien, C. (author) / Tanielian, M.H. (author)


    Publication date :

    1999


    Size :

    5 Seiten, 4 Quellen



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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