Adhesive bonding for repair of large military structures is a critical area of need for the U.S. Army as proposed new composite structures begin to enter Engineering Manufacturing Development (EMD) status. Among the critical technologies being investigated is field repair methods for thick section composite materials, such as composite integral armors. A promising alternative to thermal cure using heat-blankets is induction-based processing, which utilizes an electromagnetic field to induce heating in the adhesive bondline in order to cause rapid cure of thermosetting repair adhesives. Induction-based processing can eliminate gradients in elevated cured adhesives and reduced overall cure times. The Army is presently developing a series of self-regulating adhesive systems that cure by induction heating methods. One key to achieving induction-cured adhesives is a demonstrated method of self-regulating the heat generation to selected cure temperatures. The Army is using materials that cure adhesive pastes at predefined cure temperatures for elevated cure processing - eliminating external monitoring and control equipment, and additionally, providing uniform heating in complex composite bonding environments. Adhesive materials are currently being explored and developed to obtain high-performance adhesives for military applications. The Army envisions use of self-regulating adhesive technology as a key to field repair of proposed composite platforms such as Comanche, Crusader, and other Future Combat System vehicle structures.


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    Title :

    Induction processed adhesives for military applications


    Contributors:
    Sands, J.M. (author) / Wetzel, E.D. (author) / Yungwirth, C. (author)


    Publication date :

    2001


    Size :

    10 Seiten, 11 Quellen


    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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