In recent years, car electronic products are characterized by smaller gaps between terminal pins and high-density packaging using CSP. These trends lead to concerns that the increased strain on soldered points may result in shortened service life due to thermal fatigue, and that moisture resistance may deteriorate, as is often observed in leakage due to condensation. Conventional acrylic coating protection against moisture only increases the thermal strain on soldered points; furthermore, the use of acrylic resin itself is being scrutinized under the stringency of environmental regulations. Up to now, while automobile electric packages have demanded the high density for small and light products, electric leaks, which have occurred due to condensation, have been a major problem. To prevent any electric leaks, a conformal coating on the electric parts (ex. ECU : Electronic Control Unit) has been needed, but in general the design mies of the conformal coating (ex. Application area) is vague. Therefore, DENSO demands to clear the design rules of conformal coating electric package for higher reliability. To meet the demand, DENSO has developed a condensation simulation method using CAE that can show the occurrence condition of condensation fast and accurately. In the result, DENSO has been able to get the design ruies where to need the conformal coating in the electric package for automobiles.


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    Title :

    Condensation simulation for ECU package


    Contributors:
    Aoki, T. (author) / Okamoto, S. (author) / Ina, O. (author) / Sugiura, A. (author) / Narita, R. (author)


    Publication date :

    2004


    Size :

    9 Seiten, 19 Bilder, 2 Tabellen, 5 Quellen




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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