Avionics standard modules with redundancy offer substantial economic benefits compared to special-purpose processor units for the Orbital Transfer Vehicle and Advanced Launch Vehicle programs. A distributed, federated processing vehicle architecture provides efficient, low-risk, flexible design. Fault confinement area redundancy minimizes complexity, prevents fault propagation, allows appropriate redundancy, and enhances modularity. A fiber optic, serial vehicle bus provides high throughout with modest hardware. A unique bistage, split tapered, star optical coupler uses a token pass/token demand protocol. The system bus is an asynchronous, high-speed, parallel bus that uses a simple, round-robin token pass protocol. Off-the-shelf MIL temperature processor chips will be combined with ASICs using macrocell libraries and gate array silicon. A new packaging approach, VIP, provides testability, ease of assembly and rework, reliable connections, and electrical/thermal isolation of very high speed/density integrated circuits.


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    Title :

    Avionics standard module development


    Additional title:

    Entwicklung von Standardmodulen fuer die Avionik


    Contributors:
    Maki, S.C. (author) / Cormier, E.P. (author) / Pizkin, T.A. (author)


    Publication date :

    1987


    Size :

    8 Seiten, 14 Bilder, 2 Quellen


    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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